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  <titleInfo>
    <title>Adhesion aspects in MEMS/NEMS</title>
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  <name type="personal">
    <namePart>Kim, Seong H.</namePart>
  </name>
  <name type="personal">
    <namePart>Dugger, M. T. (Michael T.)</namePart>
  </name>
  <name type="personal">
    <namePart>Mittal, K. L.</namePart>
    <namePart type="date">1945-</namePart>
  </name>
  <name type="corporate">
    <namePart>ProQuest (Firm)</namePart>
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  <genre authority="">Electronic books.</genre>
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    <place>
      <placeTerm type="text">Leiden [Netherlands]</placeTerm>
    </place>
    <place>
      <placeTerm type="text">Boston</placeTerm>
    </place>
    <publisher>VSP</publisher>
    <dateIssued>2010</dateIssued>
    <issuance>monographic</issuance>
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  <language>
    <languageTerm authority="iso639-2b" type="code">eng</languageTerm>
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  <physicalDescription>
    <form authority="marcform">electronic</form>
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    <extent>xi, 409 p. : ill.</extent>
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  <tableOfContents>pt. 1. Understanding through continuum theory -- pt. 2. Computer simulation of interfaces -- pt. 3. Adhesion and friction measurements -- pt. 4. Adhesion in practical applications -- pt. 5. Adhesion mitigation strategies.</tableOfContents>
  <note type="statement of responsibility">edited by S.H. Kim, M.T. Dugger and K.L. Mittal.</note>
  <note>Includes bibliographical references.</note>
  <note>Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.</note>
  <subject authority="lcsh">
    <topic>Microelectromechanical systems</topic>
  </subject>
  <subject authority="lcsh">
    <topic>Nanoelectromechanical systems</topic>
  </subject>
  <subject authority="lcsh">
    <topic>Adhesion</topic>
  </subject>
  <subject authority="lcsh">
    <topic>Surfaces (Technology)</topic>
  </subject>
  <classification authority="lcc">TK7875 .A34 2010</classification>
  <classification authority="ddc" edition="22">621.381</classification>
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  <identifier type="isbn">9789004190955 (electronic bk.)</identifier>
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