TY  - BOOK
AU  - Kim,Seong H.
AU  - Dugger,M.T.
AU  - Mittal,K.L.
ED  - ProQuest (Firm)
TI  - Adhesion aspects in MEMS/NEMS
AV  - TK7875 .A34 2010
U1  - 621.381 22
PY  - 2010///
CY  - Leiden [Netherlands], Boston
PB  - VSP
KW  - Microelectromechanical systems
KW  - Nanoelectromechanical systems
KW  - Adhesion
KW  - Surfaces (Technology)
KW  - Electronic books
N1  - Includes bibliographical references; pt. 1. Understanding through continuum theory -- pt. 2. Computer simulation of interfaces -- pt. 3. Adhesion and friction measurements -- pt. 4. Adhesion in practical applications -- pt. 5. Adhesion mitigation strategies; Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries
UR  - https://ebookcentral.proquest.com/lib/kuct-ebooks/detail.action?docID=1109848
ER  -