TY  - BOOK
AU  - Gan,Brendan
AU  - Gan,Y.
AU  - Yu,Y.
ED  - International Conference on Applied Materials and Electronics Engineering
TI  - Advances in applied materials and electronics engineering III: selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China 
T2  - Advanced Materials Research,
AV  - TK7871 .A383 2014
U1  - 621.381028 23
PY  - 2014///
CY  - Durnten, Switzerland, Zurich, Switzerland
PB  - TTP
KW  - Electronics
KW  - Materials
KW  - Congresses
KW  - Materials science
KW  - Electronic books
N1  - Includes bibliographical references at the end of each chapters and indexes
UR  - https://ebookcentral.proquest.com/lib/kuct-ebooks/detail.action?docID=1910756
ER  -